CUS03 2013-11-01 1 toshiba schottky barrier rectifier schottky barrier type CUS03 switching mode power supply applications portable equipment battery applications ? forward voltage: v fm = 0.52 v@i f = 0.7 a ? average forward current: i f (av) = 0.7 a ? repetitive peak reverse voltage: v rrm = 40 v ? suitable for high-density board a ssembly due to the use of a small surface-mount package, us ? flat tm absolute maximum ratings (ta = 25c) characteristics symbol rating unit repetitive peak reverse voltage v rrm 40 v average forward current i f (av) 0.7 (note 1) a peak one cycle surge forward current (non-repetitive) i fsm 20 (50 hz) a junction temperature t j ? 40 to 150 c storage temperature range t stg ? 40 to 150 c note 1: ta = 53c: device mounted on a glass-epoxy board board size: 50 mm 50 mm, land size: 6 mm 6 mm rectangular waveform ( = 180), v r = 20 v note 2: using continuously under h eavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability signific antly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). electrical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit v fm (1) i fm = 0.1 a D 0.37 D peak forward voltage v fm (2) i fm = 0.7 a D 0.48 0.52 v i rrm (1) v rrm = 5 v D 0.4 D repetitive peak reverse current i rrm (2) v rrm = 40 v D 3.0 100 a junction capacitance c j v r = 10 v, f = 1.0 mhz D 45 D pf device mounted on a ceramic board (board size: 50 mm 50 mm) (soldering land: 2 mm 2 mm) (board thickness: 0.64 mm) D D 75 thermal resistance (junction to ambient) r th (j-a) device mounted on a glass-epoxy board (board size: 50 mm 50 mm) (soldering land: 6 mm 6 mm) (board thickness: 1.6 mm) D D 150 c/w thermal resistance (junction to lead) r th (j- ? ) junction to lead of cathode side D D 30 c/w unit: mm anode cathode 0.13 1.9 0.1 2.5 0.2 0 ~ 0.05 0.5 0.1 0.6 0.1 + 0.2 ? 0.1 1.25 0.88 0.1 0.6 0.1 0.6 0.1 0.6 0.1 1.4 0.2 0.88 0.1 0.78 0.1 + 0.05 ? 0.03 jedec D jeita D toshiba 3-2b1a weight: 0.004 g (typ.) start of commercial production 2003-11
CUS03 2013-11-01 2 marking abbreviation code part no. 3 CUS03 standard soldering pad handling precaution 1) schottky barrier diodes have reverse current characteristics compared to other diodes. there is a possibility sbd may cause th ermal runaway when it is used under high temperature or high voltage. please take forward and reverse loss into consideration during design. 2) the absolute maximum ratings denote the absolute maximu m ratings, which are rated values and must not be exceeded during operation, even fo r an instant. the following are the general derating methods that we recommend for designing a circuit using this device. v rrm : use this rating with reference to (1) above. v rrm has a temperature coefficient of 0.1%/c. take this temperature coefficient into account wh en designing a device at low temperature. i f (av) : we recommend that the worst-case current be no greater than 80% of the absolute maximum rating of i f (av) and t j be below 120c. when using this device, please take the margin into consideration by using an allowable ta max-i f (av) curve. i fsm : this rating specifies the non-repetitive peak current. this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. t j : derate this rating when using a device to ensure high reliability. we recommend that the device be used at t j below 120c. 3) thermal resistance between junction and ambient fluc tuates depending on the device?s mounting condition. when using a device, design a circuit board and a so ldering land size to match the appropriate thermal resistance value. 4) refer to the rectifiers databook for further information. 2.0 1.1 unit: mm 0.5 0.8 0.8
CUS03 2013-11-01 3 0.5 0 0.0 0.2 0.4 0.6 1.0 0.8 1.2 0.3 0.1 0.2 0.4 180 120 dc = 60 instantaneous forward voltage v f (v) i f ? v f instantaneous forward current i f (a) average forward current i f (av) (a) p f (av) ? i f (av) average forward power dissipation p f (av) (w) average forward current i f (av) (a) ta m a x ? i f (av) maximum allowable ambient temperature ta m a x ( c ) average forward current i f (av) (a) t ? max ? i f (av) maximum allowable lead temperature t ? max (c) rectangular waveform 0 360 conduction angle: 160 0 0.0 0.2 0.4 0.6 1.0 80 20 40 100 120 0.8 1.2 140 180 120 dc = 60 60 rectangular waveform 0 360 conduction angle: v r = 20 v i f ( av ) maximum allowable ambient temperature ta m a x ( c ) average forward current i f (av) (a) ta m a x ? i f (av) device mounted on a glass-epoxy board (board size: 50 mm 50 mm, land size: 6 mm 6 mm) 0 0.0 160 0.2 0.4 0.6 1.0 60 20 40 80 100 0.8 1.2 120 dc = 60 140 120 180 rectangular waveform 0 360 conduction angle: v r = 20 v i f ( av ) 0.01 0.0 75c 25c t j = 150c 10 1 0.1 0.2 0.4 0.6 0.8 1.2 100c 1.0 0 0.0 160 0.2 0.4 0.6 1.0 60 20 40 80 100 0.8 1.2 120 dc = 60 140 120 180 device mounted on a ceramic board (board size: 50 mm 50 mm, land size: 2 mm 2 mm) rectangular waveform 0 360 conduction angle: v r = 20 v i f ( av ) transient thermal impedance r th (j-a) (c/w) time t (s) r th (j-a) ? t 1 0.001 1000 0.01 0.1 1 10 100 1000 10 100 10000 (2) device mounted on a glass-epoxy board: board size:50 mm 50 mm soldering land: 6.0 mm 6.0 mm board thickness:1.6 mm (3) device mounted on a glass-epoxy board: board size: 50 mm 50 mm standard soldering pad board thickness:1.6 mm (2) (3) (1) (1) device mounted on a ceramic board: board size:50 mm 50 mm soldering land: 2.0 mm 2.0 mm board thickness : 0.64 mm
CUS03 2013-11-01 4 average reverse power dissipation p r (av) (w) number of cycles surge forward current (non-repetitive) peak surge forward current i fsm (a) reverse voltage v r (v) c j ? v r (typ.) junction capacitance c j (pf) junction temperature t j (c) i r ? t j (typ.) reverse current i r (ma) reverse voltage v r (v) p r (av) ? v r (typ.) 0.8 0.0 0 10 20 40 0.7 0.3 0.2 0.5 120 60 180 300 240 dc 0.1 0.4 0.6 30 rectangular waveform 0 360 conduction angle: t j = 150c 0 1 ta = 25c f = 50 hz 24 10 100 20 16 12 8 4 1000 10 1 ta = 2 5 c f = 1 mhz 10 100 100 30 v v r = 40 v pulse test 0.0001 0 100 1 0.01 10 10 v 5 v 20 v 40 120 160 20 100 140 60 80 0.1 0.001
CUS03 2013-11-01 5 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduc tion is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? 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